Events Highlight 2019

Preliminary (Second Round), Final and Award Presentation CeremonyJuly 13, 2019 Preliminary (First Round) July 6, 2019 Student Lecture June 29, 2019 Open Seminar May 11,Read More

AI@FinTech-2019

The competition aims to encourage students to learn science, technology, engineering and mathematics (STEM) in financial application and innovation of science and technology’s enthusiasm, improveRead More

Committee

Honorary Chair 名譽主席Prof. Martin D.F. WONG, Dean, Faculty of Engineering, CUHK   香港中文大學工程學院院長黃定發教授 General Chair 大會主席Prof. Jeffrey Xu YU (Professor and Chairman, Department of SEEM,Read More

Introduction

Introduction of Competition The 1st Interschool Fintech Application and Innovation Competition is co-organized by Hong Kong Subsidized Secondary Schools Council, Grant School Council and DepartmentRead More

Loading Image